Patent Assignment
Reel/Frame 020072/0969
Assignment of Assignor's Interest
Recorded: 2007-11-05
Pages: 3
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2007-08-22
Assignee
TOKYO ELECTRON LIMITED
3-6 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-8481, JAPAN
Covered Properties
(9)
Test Probe Having Elongated Conductor Embedded in an Elastomeric Material Which Is Mounted on a Space Transformer
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5,635,846 →
Application:
08/055,485 →
High Density Cantilevered Probe for Electronic Devices
Patent:
5,811,982 →
Application:
08/614,417 →
Test Probe for High Density Integrated Circuits Methods of Fabrication Thereof and Methods of Use Thereof
Patent:
5,821,763 →
Application:
08/754,869 →
High Density Integrated Circuit Apparatus, Test Probe and Methods of Use Thereof
Patent:
6,334,247 →
Application:
08/872,519 →
High Density Cantilevered Probe for Electronic Devices
Patent:
5,914,614 →
Application:
08/946,141 →
High Density Integrated Circuit Apparatus, Test Probe and Methods of Use Thereof
Patent:
6,300,780 →
Application:
09/088,394 →
High Density Cantilevered Probe for Electronic Devices
Patent:
6,329,827 →
Application:
09/208,529 →
A Method of Forming a Sturcture for Electronic Devices Contact Locations
A Method for Fabricating a Structure for Making Contact with an Ic Device