IP Library › Assignment 020130/0145
Patent Assignment
Reel/Frame 020130/0145

Assignment of Assignor's Interest

Recorded: 2007-11-19 Pages: 5
Assignor
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Properties (13)
Semiconductor Structure Including Isolation Region with Variable Linewidth and Method for Fabrication Therof
Application: 11/424,076 →
Publication: US 2007/0293016
Integrated Circuit Manufacturing Method Using Hard Mask
Patent: 7,615,484 →
Application: 11/739,595 →
Publication: US 2008/0265409
Mosfet with Metal Gate Electrode
Application: 11/837,161 →
Publication: US 2009/0039441
Spacer Undercut Filler, Method of Manufacture Thereof and Articles Comprising the Same
Application: 11/845,448 →
Publication: US 2009/0057755
Plasma Vapor Deposition
Patent: 9,194,036 →
Application: 11/851,269 →
Publication: US 2009/0065349
Electro Chemical Deposition Systems and Methods of Manufacturing Using the Same
Patent: 8,197,660 →
Application: 11/852,910 →
Publication: US 2009/0068771
System and Method for Semiconductor Device Fabrication Using Modeling
Patent: 7,669,176 →
Application: 11/855,887 →
Publication: US 2009/0077525
Integrated Circuits and Methods of Design and Manufacture Thereof
Patent: 7,785,946 →
Application: 11/860,955 →
Publication: US 2009/0079005
Methods of Patterning Insulating Layers Using Etching Techniques That Compensate for Etch Rate Variations
Patent: 8,058,176 →
Application: 11/861,478 →
Publication: US 2009/0081873
Lithography Systems and Methods of Manufacturing Using Thereof
Application: 11/868,362 →
Publication: US 2009/0091729
Lithography Systems and Methods of Manufacturing Using Thereof
Patent: 8,715,909 →
Application: 11/868,374 →
Publication: US 2009/0092926
Method for Fabricating a Semiconductor Gate Structure
Patent: 7,745,292 →
Application: 11/872,298 →
Publication: US 2009/0098692
Methods of Forming Field Effect Transistors Having Stress-Inducing Sidewall Insulating Spacers Thereon
Patent: 7,923,365 →
Application: 11/874,118 →
Publication: US 2009/0101979
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 14, 2006
From: LUO, ZHIJIONG; NG, HUNG Y.; ROVEDO, NIVO; NGUYEN, PHUNG T.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 017781/0305 →
Assignment of Assignor's Interest Jun 14, 2006
From: LINDSAY, RICHARD
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 017781/0511 →
Assignment of Assignor's Interest Jun 14, 2006
From: LUN, ZHAO
To: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
Reel/Frame 017781/0408 →
Corrective Assignment to Correct the Conveying Parties: Should Be: Zhao Lun 05/08/2006 Yung Fu Chong 05/08/2006 Previously Recorded on Reel 017781 Frame 0408. Assignor(S) Hereby Confirms the Cover Sheet Executed Patent Assignment Form. Jul 5, 2006
From: LUN, ZHAO; CHONG, YUNG FU
To: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
Reel/Frame 017877/0845 →
Assignment of Assignor's Interest Apr 24, 2007
From: FITZSIMMONS, JOHN A.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 019205/0126 →
Assignment of Assignor's Interest Apr 24, 2007
From: LIU, WUPING
To: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
Reel/Frame 019205/0105 →
Assignment of Assignor's Interest Apr 24, 2007
From: BECK, MICHAEL
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 019205/0120 →
Assignment of Assignor's Interest Aug 28, 2007
From: SUH, BONG-SEOK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019753/0604 →
Assignment of Assignor's Interest Aug 28, 2007
From: DYER, THOMAS W.; KWON, OH-JUNG; ROVEDO, NIVO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 019753/0395 →
Assignment of Assignor's Interest Aug 28, 2007
From: KWON, O SUNG
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP
Reel/Frame 019753/0492 →
Assignment of Assignor's Interest Sep 26, 2007
From: SRIVASTAVA, RAVI PRAKASH
To: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
Reel/Frame 019879/0230 →
Assignment of Assignor's Interest Sep 26, 2007
From: PARK, WAN JAE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019879/0032 →
Assignment of Assignor's Interest Sep 26, 2007
From: KUMAR, KAUSHIK ARUN; LISI, ANTHONY DAVID
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 019879/0106 →
Assignment of Assignor's Interest Sep 26, 2007
From: LINVILLE, JOSEPH EDWARD
To: ADVANCED MICRO DEVICES CORPORATION
Reel/Frame 019879/0159 →
Assignment of Assignor's Interest Sep 27, 2007
From: HAFFNER, HENNING
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 019887/0715 →
Assignment of Assignor's Interest Oct 17, 2007
From: WIDODO, JOHNNY
To: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
Reel/Frame 019977/0712 →
Assignment of Assignor's Interest Oct 17, 2007
From: KIM, JUN JUNG; PARK, SANG JINE; LEE, MIN HO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019977/0698 →
Assignment of Assignor's Interest Oct 17, 2007
From: DYER, THOMAS W.; FANG, SUNFEI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 019977/0707 →
Assignment of Assignor's Interest Oct 18, 2007
From: KIM, SUN-OO; CHAE, MOOSUNG; MOON, BUM KI
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 019978/0728 →
Assignment of Assignor's Interest Oct 18, 2007
From: WENDT, HERMANN
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 019978/0667 →
Assignment of Assignor's Interest Oct 18, 2007
From: CHAE, MOOSUNG; MOON, BUM KI; KIM, SUN-OO; SHUM, DANNY PAK-CHUM
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 019978/0701 →
Assignment of Assignor's Interest Nov 6, 2007
From: HAFFNER, HENNING; ELLER, MANFRED; LINDSAY, RICHARD
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 020074/0207 →
Assignment of Assignor's Interest Nov 6, 2007
From: LUAN, HONGFA
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 020073/0962 →
Assignment of Assignor's Interest Nov 6, 2007
From: KWON, O SUNG
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 020073/0991 →
Assignment of Assignor's Interest Nov 12, 2007
From: KIM, JONGYO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 020095/0842 →