IP Library › Assignment 020211/0423
Patent Assignment
Reel/Frame 020211/0423

Assignment of Assignor's Interest

Recorded: 2007-12-07 Pages: 5
Assignors
SIMON, JUERGEN
Executed: 2007-12-02
SINGLETON, LAURENCE EDWARD
Executed: 2007-11-19
Assignee
QIMONDA AG
GUSTAV-HEINEMANN-RING 212, MUNICH, 81739, GERMANY
Covered Property (1)
Semiconductor Device with Different Conductive Features Embedded in a Mold Enclosing a Semiconductor Die and Method for Making Same
Patent: 7,772,033 →
Application: 11/864,433 →
Publication: US 2009/0085190
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Nov 19, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 037147/0487 →
Assignment of Assignor's Interest Nov 30, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 037171/0719 →