Patent Assignment
Reel/Frame 020233/0222
Assignment of Assignor's Interest
Recorded: 2007-12-12
Pages: 5
Assignors
KUAN, HEAP HOE
Executed: 2007-12-11
CHOW, SENG GUAN
Executed: 2007-12-11
CHUA, LINDA PEI EE
Executed: 2007-12-11
MERILO, DIOSCORO A.
Executed: 2007-12-11
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Mountable Integrated Circuit Package System with Mountable Integrated Circuit Die
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 11, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038401/0532 →
Release of Security Interest
Jun 5, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052850/0237 →
Corrective Assignment to Correct the Correct the Spelling of Assignee's Name from "Stats Chippac Pte. Lte," to "Stats Chippac Pte. Ltd." Previously Recorded at Reel: 038401 Frame: 0532. Assignor(S) Hereby Confirms the Assignment.
Sep 1, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064803/0109 →