IP Library › Assignment 020286/0316
Patent Assignment
Reel/Frame 020286/0316

Assignment of Assignor's Interest

Recorded: 2007-12-24 Pages: 2
Assignors
HEDLER, HARRY
Executed: 2002-04-24
WENNEMUTH, INGO
Executed: 2002-04-23
Assignee
INFINEON TECHNOLOGIES AG
ST.-MARTIN-STR. 53, HOLLYWOOD, 81669, GERMANY
Covered Property (1)
Electronic Component with Semiconductor Chips, Electronic Assembly Composed of Stacked Semiconductor Chips, and Methods for Producing an Electronic Component and an Electronic Assembly
Patent: 7,342,320 →
Application: 10/132,826 →
Publication: US 2002/0158345
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 12, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023768/0001 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Sep 15, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036615/0885 →