Patent Assignment
Reel/Frame 020295/0020
Assignment of Assignor's Interest
Recorded: 2007-12-27
Pages: 5
Assignors
LEE, WOONG SUN
Executed: 2007-12-20
CHO, IL HWAN
Executed: 2007-12-20
PARK, MYUNG GEUN
Executed: 2007-12-20
JOH, CHEOL HO
Executed: 2007-12-20
DO, EUN HYE
Executed: 2007-12-20
KIM, KI YOUNG
Executed: 2007-12-20
KIM, JI EUN
Executed: 2007-12-20
NAM, JONG HYUN
Executed: 2007-12-20
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Flip Chip Package and Method for Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 6, 2024
From: HYNIX-SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067328/0814 →
Assignment of Assignor's Interest
May 9, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067369/0832 →
Corrective Assignment to Correct the Assignee Is Hynix Semiconductor Inc. Not Hynix-Semiconductor Inc. There Is No Hyphen in the Name. Previously Recorded on Reel 67328 Frame 814. Assignor(S) Hereby Confirms the Change of Name.
May 14, 2024
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067412/0482 →