Patent Assignment
Reel/Frame 020379/0253
Assignment of Assignor's Interest
Recorded: 2008-01-17
Pages: 3
Assignee
HYMITE GMBH
CARL-SCHEELE-STR. 12, BERLIN, D-12489, GERMANY
Covered Property
(1)
Fabrication of Compact Semiconductor Packages
Application:
12/014,443 →
Publication:
US 2009/0181500
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 31, 2008
From: HYMITE GMBH
To: HYMITE A/S
Reel/Frame 020450/0282 →
Assignment of Assignor's Interest
Nov 30, 2010
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025403/0566 →
Assignment of Assignor's Interest
Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0949 →