Covered Property (1)

Related Assignments (9)

Other recorded transfers of the patent in this record — the chain of ownership.

Security Agreement Apr 1, 2011

From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX

To: BANK OF AMERICA, N.A.

Reel/Frame 026064/0720 →

Security Agreement Oct 1, 2012

From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.

To: GOLDMAN SACHS BANK USA

Reel/Frame 029057/0810 →

Release of Security Interest Dec 26, 2013

From: BANK OF AMERICA, N.A.

To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)

Reel/Frame 031870/0031 →

Release of Security Interest Dec 26, 2013

From: GOLDMAN SACHS BANK USA

To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)

Reel/Frame 031870/0092 →

Security Agreement Jan 30, 2014

From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC

To: DEUTSCHE BANK AG NEW YORK BRANCH

Reel/Frame 032177/0359 →

Release of Security Interest Mar 3, 2014

From: DEUTSCHE BANK AG NEW YORK BRANCH

To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.

Reel/Frame 032382/0724 →

Assignment of Assignor's Interest May 27, 2014

From: MEMC ELECTRONIC MATERIALS, INC.

To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)

Reel/Frame 033023/0430 →

Notice of License Agreement Jun 6, 2014

From: SUNEDISON SEMICONDUCTOR LIMITED

To: SUNEDISON SEMICONDUCTOR TECHNOLOGY PTE. LTD.

Reel/Frame 033099/0001 →

Assignment of Assignor's Interest Jun 7, 2018

From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.

To: GLOBALWAFERS CO., LTD.

Reel/Frame 046327/0001 →