IP Library › Assignment 020756/0596
Patent Assignment
Reel/Frame 020756/0596

Assignment of Assignor's Interest

Recorded: 2008-03-26 Pages: 3
Assignor
NEGISHI, YUJI
Executed: 2008-03-21
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO 151-8543, JAPAN
Covered Property (1)
Semiconductor Device Comprising Circuit Substrate with Inspection Connection Pads and Manufacturing Method Thereof
Patent: 7,932,517 →
Application: 12/079,259 →
Publication: US 2008/0237589
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Ownership by Corporate Separation Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027465/0812 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027465, Frame 0812 Jan 6, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027492/0449 →
Assignment of Assignor's Interest Jan 27, 2017
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 041521/0001 →
Merger Jan 27, 2017
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 041664/0471 →