Patent Assignment
Reel/Frame 020900/0531
Assignment of Assignor's Interest
Recorded: 2008-05-05
Pages: 2
Assignee
NIPPON MINING & METALS CO., LTD.
10-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Resin Substrate Material, Electronic Component Substrate Material Manufactured by Electroless Plating on the Same, and Method for Manufacturing Electronic Component Substrate Material
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name
May 29, 2014
From: NIPPON MINING & METALS CO., LTD.; NIPPON MINING HOLDINGS INC.
To: NIPPON MINING HOLDINGS INC.
Reel/Frame 033053/0755 →
Change of Name
Jun 12, 2014
From: NIPPON MINING HOLDINGS, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 033091/0316 →
Change of Address
Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →