Patent Assignment
Reel/Frame 021126/0765
Assignment of Assignor's Interest
Recorded: 2008-06-20
Pages: 5
Assignors
PERIAMAN, SHANGGAR
Executed: 2006-12-19
OOI, KOOI CHI
Executed: 2006-12-19
BOK ENG, CHEAH
Executed: 2006-12-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Stacked-Die Packages with Silicon Vias and Surface Activated Bonding
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Spelling of the Third Named Assignor as Previously Recorded on Reel 021126 Frame 0765. Assignor(S) Hereby Confirms the Third Assignor Should Read: Cheah, Bok Eng.
Aug 27, 2008
From: PERIAMAN, SHANGGAR; OOI, KOOI CHI; CHEAH, BOK ENG
To: INTEL CORPORATION
Reel/Frame 021449/0618 →
Assignment of Assignor's Interest
Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →