Corrective Assignment to Correct the Spelling of the Third Named Assignor as Previously Recorded on Reel 021126 Frame 0765. Assignor(S) Hereby Confirms the Third Assignor Should Read: Cheah, Bok Eng.

Recorded: 2008-08-27 Pages: 9

Assignors

PERIAMAN, SHANGGAR

Executed: 2008-08-23

OOI, KOOI CHI

Executed: 2008-08-21

CHEAH, BOK ENG

Executed: 2008-08-20

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052

Covered Property (1)

Stacked-Die Packages with Silicon Vias and Surface Activated Bonding

Patent: 7,692,278 →

Application: 11/642,293 →

Publication: US 2008/0150155

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.