Patent Assignment
Reel/Frame 021200/0006
Assignment of Assignor's Interest
Recorded: 2008-07-07
Pages: 3
Assignors
OHTAKE, HIROTO
Executed: 2008-06-23
TADA, MUNEHIRO
Executed: 2008-06-23
UEKI, MAKOTO
Executed: 2008-06-23
HAYASHI, YOSHIHIRO
Executed: 2008-06-23
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Dual Damascene Multilayer Interconnect Structure Having Film Density of the Wiring Groove Sidewall Portion Away from via Hole Contact Lower Than the Sidewall Portion Directly Above the via Hole Contact.
Application:
12/160,149 →
Publication:
US 2009/0014887
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.