Patent Assignment
Reel/Frame 021324/0756
Assignment of Assignor's Interest
Recorded: 2008-07-31
Pages: 8
Assignors
ST. AMAND, ROGER D.
Executed: 2008-07-28
MILLER JR., AUGUST JOSEPH
Executed: 2008-07-28
COPIA, ALEXANDER WILLIAM
Executed: 2008-07-28
OH, KWANGSEOK
Executed: 2008-07-30
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Stacked Inverted Flip Chip Package and Fabrication Method
Patent:
8,836,115 →
Application:
12/183,778 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →