Patent Assignment
Reel/Frame 021420/0974
Assignment of Assignor's Interest
Recorded: 2008-08-20
Pages: 2
Assignor
HITACHI, LTD.
Executed: 2003-09-12
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Manufacturing Method of a Semiconductor Device
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 24, 2008
From: SHIMANUKI, YOSHIHIKO; SUZUKI, MASAYUKI
To: HITACHI, LTD.; HITACHI YONEZAWA ELECTRONICS CO. LTD.
Reel/Frame 021187/0784 →
Merger
Jul 7, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024662/0280 →
Merger
May 12, 2017
From: HITACHI YONEZAWA ELECTRONICS CO., LTD.
To: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 042595/0189 →
Change of Name
May 12, 2017
From: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042458/0022 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →