IP Library Assignment 021448/0164
Patent Assignment
Reel/Frame 021448/0164

Assignment of Assignor's Interest

Recorded: 2008-08-27 Pages: 8
Assignors
OH, JONG-HOON
Executed: 2008-01-30
HUMMLER, KLAUS
Executed: 2008-01-30
KIEHL, OLIVER
Executed: 2008-01-29
SCHNELL, JOSEF
Executed: 2008-01-30
ELLIS, WAYNE FREDERICK
Executed: 2008-01-30
KIM, JUNG PILL
Executed: 2008-01-30
COLLINS, LEE WARD
Executed: 2008-01-31
BELDIMAN, OCTAVIAN
Executed: 2008-01-30
Assignee
QIMONDA NORTH AMERICA CORP.
3000 CENTREGREEN WAY, CARY, NORTH CAROLINA, 27513
Covered Property (1)
Multi-Chip Package with Interconnected Stacked Chips
Patent: 8,138,610 →
Application: 12/028,542 →
Publication: US 2009/0200652
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 15, 2011
From: QIMONDA NORTH AMERICA CORP
To: QIMONDA AG
Reel/Frame 026138/0613 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Dec 9, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 037254/0782 →