IP Library › Assignment 021538/0001
Patent Assignment
Reel/Frame 021538/0001

Assignment of Assignor's Interest

Recorded: 2008-09-16 Pages: 7
Assignors
TAKIAR, HEM
Executed: 2008-09-12
BHAGATH, SHRIKAR
Executed: 2008-09-12
YU, CHEEMEN
Executed: 2008-09-11
LIAO, CHIH-CHIN
Executed: 2008-06-30
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Stacked Semiconductor Package with Localized Cavities for Wire Bonding
Patent: 8,294,251 →
Application: 12/165,320 →
Publication: US 2009/0321950
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 13, 2011
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 026278/0690 →
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0600 →