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Patent Assignment
Reel/Frame 026278/0690

Assignment of Assignor's Interest

Recorded: 2011-05-13 Pages: 6
Assignor
SANDISK CORPORATION
Executed: 2011-04-04
Assignee
SANDISK TECHNOLOGIES INC.
6900 NORTH DALLAS PARKWAY, TWO LEGACY TOWN CENTER, PLANO, TEXAS, 75024
Covered Property (1)
Stacked Semiconductor Package with Localized Cavities for Wire Bonding
Patent: 8,294,251 →
Application: 12/165,320 →
Publication: US 2009/0321950
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 16, 2008
From: TAKIAR, HEM; BHAGATH, SHRIKAR; YU, CHEEMEN; LIAO, CHIH-CHIN
To: SANDISK CORPORATION
Reel/Frame 021538/0001 →
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0600 →