IP Library › Assignment 021539/0553
Patent Assignment
Reel/Frame 021539/0553

Assignment of Assignor's Interest

Recorded: 2008-09-16 Pages: 5
Assignors
TAKIAR, HEM
Executed: 2008-09-12
BHAGATH, SHRIKAR
Executed: 2008-09-12
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Method of Fabricating Stacked Wire Bonded Semiconductor Package with Low Profile Bond Line
Patent: 8,241,953 →
Application: 12/165,340 →
Publication: US 2009/0325344
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 13, 2011
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 026279/0950 →
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0600 →