Assignment of Assignor's Interest

Recorded: 2011-05-13 Pages: 6

Assignor

SANDISK CORPORATION

Executed: 2011-04-04

Assignee

SANDISK TECHNOLOGIES INC.

6900 NORTH DALLAS PARKWAY, TWO LEGACY TOWN CENTER, PLANO, TEXAS, 75024

Covered Property (1)

Method of Fabricating Stacked Wire Bonded Semiconductor Package with Low Profile Bond Line

Patent: 8,241,953 →

Application: 12/165,340 →

Publication: US 2009/0325344

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.