Patent Assignment
Reel/Frame 021743/0046
Assignment of Assignor's Interest
Recorded: 2008-10-27
Pages: 4
Assignors
WANG, YI XIANG
Executed: 2008-10-24
DOU, JUYING
Executed: 2008-10-27
JIANG, JUN
Executed: 2008-10-26
FAN, ZHENG
Executed: 2008-10-24
MENG, QINGYU
Executed: 2008-10-24
Assignee
HERMES-MICROVISION, INC.
5F NO. 18 CREATION ROAD 1, HSINCHU SCIENCE PARK, HISNCHU, 300, TAIWAN
Covered Property
(1)
Wafer Grounding Methodology
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 22, 2011
From: KANAI, KENICHI; CHEN, JAY
To: HERMES-MICROVISION, INC.
Reel/Frame 026786/0913 →
Assignment of Assignor's Interest
Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
Assignment of Assignor's Interest
Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →