IP Library › Assignment 026786/0913
Patent Assignment
Reel/Frame 026786/0913

Assignment of Assignor's Interest

Recorded: 2011-08-22 Pages: 2
Assignors
KANAI, KENICHI
Executed: 2011-07-13
CHEN, JAY
Executed: 2011-07-13
Assignee
HERMES-MICROVISION, INC.
5F, NO. 18, CREATION ROAD 1, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property (1)
Wafer Grounding Methodology
Patent: 8,094,428 →
Application: 12/259,216 →
Publication: US 2010/0103583
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 27, 2008
From: WANG, YI XIANG; DOU, JUYING; JIANG, JUN; FAN, ZHENG
To: HERMES-MICROVISION, INC.
Reel/Frame 021743/0046 →
Assignment of Assignor's Interest Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
Assignment of Assignor's Interest Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →