IP Library Assignment 021744/0521
Patent Assignment
Reel/Frame 021744/0521

Assignment of Assignor's Interest

Recorded: 2008-10-28 Pages: 4
Assignor
HITACHI, LTD.
Executed: 2008-10-23
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (7)
Process for Manufacturing Semiconductor Integrated Circuit Device
Patent: 6,376,345 →
Application: 09/356,707 →
Process for Manufacturing Semiconductor Integrated Circuit Device
Patent: 6,458,674 →
Application: 10/050,562 →
Publication: US 2002/0058363
Process for Manufacturing Semiconductor Integrated Circuit Device
Patent: 6,531,400 →
Application: 10/222,848 →
Publication: US 2002/0192967
Process for Manufacturing Semiconductor Integrated Circuit Device
Patent: 6,800,557 →
Application: 10/369,716 →
Publication: US 2003/0153187
Process for manufacturing semiconductor integrated circuit device
Application: 10/760,292 →
Publication: US 2004/0152298
Process for Manufacturing Semiconductor Integrated Circuit Device
Patent: 7,510,970 →
Application: 11/357,181 →
Publication: US 2006/0141792
Process for Manufacturing Semiconductor Integrated Circuit Device
Patent: 7,659,201 →
Application: 12/127,564 →
Publication: US 2008/0233736
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 20, 1999
From: OHASHI, NAOFUMI; NOGUCHI, JUNJI; IMAI, TOSHINORI; YAMAGUCHI, HIZURU
To: HITACHI, LTD.
Reel/Frame 010328/0865 →
Assignment of Assignor's Interest Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014569/0585 →
Merger Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →