IP Library Assignment 021746/0166
Patent Assignment
Reel/Frame 021746/0166

Assignment of Assignor's Interest

Recorded: 2008-10-28 Pages: 15
Assignors
RYAN, E. TODD
Executed: 2008-10-23
SCHUEHRER, HOLGER
Executed: 2008-10-15
RHEE, SEUNG-HYUN
Executed: 2008-10-14
Assignee
ADVANCED MICRO DEVICES, INC.
7171 SOUTHWEST PARKWAY, AUSTIN, TEXAS, 78735
Covered Property (1)
Method and Apparatus for Reducing Semiconductor Package Tensile Stress
Patent: 8,212,346 →
Application: 12/259,357 →
Publication: US 2010/0102435
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Affirmation of Patent Assignment Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023120/0426 →
Security Agreement Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →