IP Library › Assignment 021823/0837
Patent Assignment
Reel/Frame 021823/0837

Assignment of Assignor's Interest

Recorded: 2008-11-11 Pages: 4
Assignors
HOU, PO-KAI
Executed: 2008-11-04
SHIH, CHI-JIN
Executed: 2008-11-04
Assignee
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property (1)
Chip Package with a Dam Structure on a Die Pad
Patent: 7,812,432 →
Application: 12/268,591 →
Publication: US 2009/0224384
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Re-Record to Correct the Execution Date of the Second Assignor, Previously Recorded on Reel 021823 Frame 0837. Apr 15, 2010
From: HOU, PO-KAI; SHIH, CHI-JIN
To: CHIPMOS TECHNOLOGIES INC.
Reel/Frame 024242/0514 →