Patent Assignment
Reel/Frame 024242/0514
Re-Record to Correct the Execution Date of the Second Assignor, Previously Recorded on Reel 021823 Frame 0837.
Recorded: 2010-04-15
Pages: 4
Assignee
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Chip Package with a Dam Structure on a Die Pad
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.