Patent Assignment
Reel/Frame 021897/0488
Assignment of Assignor's Interest
Recorded: 2008-11-26
Pages: 6
Assignors
CHOI, DAESIK
Executed: 2008-11-17
YANG, DEOKKYUNG
Executed: 2008-11-17
HA, JONG-WOO
Executed: 2008-11-17
JANG, BYOUNG WOOK
Executed: 2008-11-17
BAE, JAESICK
Executed: 2008-11-17
KIM, SEUNG WON
Executed: 2008-11-17
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System Having an Internal Structure Protrusion and Method of Manufacture Thereof
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0301 →
Release of Security Interest
Jun 11, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052907/0650 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0301. Assignor(S) Hereby Confirms the Change of Name.
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064913/0352 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →