Patent Assignment
Reel/Frame 021924/0643
After-Acquired Intellectual Property Kun-Pledge Agreement
Recorded: 2008-12-05
Pages: 7
Assignor
MAGNACHIP SEMICONDUCTOR, LTD.
Executed: 2008-12-04
Assignee
U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
100 WALL STREET, SUITE 1600, NEW YORK, NEW YORK, 10005
Covered Properties
(5)
Global Planarization Using Sog and Cmp
Patent:
5,312,512 →
Application:
07/965,309 →
Method of Manufacturing Sram Having Enhanced Cell Ratio
Patent:
6,281,088 →
Application:
09/324,289 →
Smart Power Device and Method for Fabricating the Same
Patent:
6,465,845 →
Application:
09/500,575 →
Operational Transconductance Amplifier for an Output Buffer
Method of Forming Metal Line in Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest
Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 024563 Frame: 0807. Assignor(S) Hereby Confirms the Release by Secured Party.
Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →
Assignment of Assignor's Interest
Jan 18, 2019
From: MAGNACHIP SEMICONDUCTOR, LTD
To: ATRIA TECHNOLOGIES INC.
Reel/Frame 048058/0864 →
Assignment of Assignor's Interest
Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →