Patent Assignment
Reel/Frame 021934/0250
Assignment of Assignor's Interest
Recorded: 2008-12-06
Pages: 5
Assignors
LEE, HI-KUK
Executed: 2008-07-16
YUN, SANG-HYUN
Executed: 2008-07-16
LEE, MIN-SOO
Executed: 2008-07-17
KANG, DEOK-MAN
Executed: 2008-11-28
OH, SAE-TAE
Executed: 2008-11-28
CHOI, JAE-YOUNG
Executed: 2008-11-28
Assignees
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
AZ ELECTRONIC MATERIALS (JAPAN) K.K.
BUNKYO GREEN COURT, 28-8, HONKOMAGOME 2-CHOME, BUNKYO-KU, TOKYO, 113-0021, JAPAN
Covered Property
(1)
Photoresist Composition and Method of Manufacturing Array Substrate Using the Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 28, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028863/0858 →
Assignment of Assignor's Interest
Jan 17, 2013
From: AZ ELECTRONIC MATERIALS (JAPAN) K.K
To: AZ ELECTRONIC MATERIALS (KOREA) LTD.
Reel/Frame 029649/0583 →
Assignment of Assignor's Interest
Nov 7, 2016
From: MERCK ELECTRONIC MATERIALS LTD.
To: MERCK PATENT GMBH
Reel/Frame 040243/0465 →
Change of Name
Nov 7, 2016
From: AZ ELECTRONIC MATERIALS KOREA LTD.
To: MERCK ELECTRONIC MATERIALS LTD.
Reel/Frame 040574/0815 →
Assignment of Assignor's Interest
May 17, 2022
From: MERCK PATENT GMBH
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 060102/0459 →