Patent Assignment
Reel/Frame 040243/0465
Assignment of Assignor's Interest
Recorded: 2016-11-07
Pages: 3
Assignor
MERCK ELECTRONIC MATERIALS LTD.
Executed: 2016-08-30
Assignee
MERCK PATENT GMBH
FRANKFURTER STRASSE 250, DARMSTADT, 64293, GERMANY
Covered Property
(1)
Photoresist Composition and Method of Manufacturing Array Substrate Using the Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 6, 2008
From: LEE, HI-KUK; YUN, SANG-HYUN; LEE, MIN-SOO; KANG, DEOK-MAN
To: SAMSUNG ELECTRONICS CO., LTD.; AZ ELECTRONIC MATERIALS (JAPAN) K.K.
Reel/Frame 021934/0250 →
Change of Name
Aug 28, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028863/0858 →
Assignment of Assignor's Interest
Jan 17, 2013
From: AZ ELECTRONIC MATERIALS (JAPAN) K.K
To: AZ ELECTRONIC MATERIALS (KOREA) LTD.
Reel/Frame 029649/0583 →
Change of Name
Nov 7, 2016
From: AZ ELECTRONIC MATERIALS KOREA LTD.
To: MERCK ELECTRONIC MATERIALS LTD.
Reel/Frame 040574/0815 →
Assignment of Assignor's Interest
May 17, 2022
From: MERCK PATENT GMBH
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 060102/0459 →