Patent Assignment
Reel/Frame 040574/0815
Change of Name
Recorded: 2016-11-07
Pages: 14
Assignor
AZ ELECTRONIC MATERIALS KOREA LTD.
Executed: 2015-10-27
Assignee
MERCK ELECTRONIC MATERIALS LTD.
5TH FLOOR, 508, TEHERAN-RO, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Photoresist Composition and Method of Manufacturing Array Substrate Using the Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 6, 2008
From: LEE, HI-KUK; YUN, SANG-HYUN; LEE, MIN-SOO; KANG, DEOK-MAN
To: SAMSUNG ELECTRONICS CO., LTD.; AZ ELECTRONIC MATERIALS (JAPAN) K.K.
Reel/Frame 021934/0250 →
Change of Name
Aug 28, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028863/0858 →
Assignment of Assignor's Interest
Jan 17, 2013
From: AZ ELECTRONIC MATERIALS (JAPAN) K.K
To: AZ ELECTRONIC MATERIALS (KOREA) LTD.
Reel/Frame 029649/0583 →
Assignment of Assignor's Interest
Nov 7, 2016
From: MERCK ELECTRONIC MATERIALS LTD.
To: MERCK PATENT GMBH
Reel/Frame 040243/0465 →
Assignment of Assignor's Interest
May 17, 2022
From: MERCK PATENT GMBH
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 060102/0459 →