IP Library Granted Patent US 7,927,897
Granted Patent B2
US 7,927,897 · App. 12/327,215 · Granted Apr 19, 2011

Photoresist composition and method of manufacturing array substrate using the same

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Quick Facts
Patent No.
US 7,927,897
App. No.
12/327,215
Granted
Apr 19, 2011
Kind
B2
Abstract

A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.

Claims (16)

1. A method of manufacturing an array substrate, comprising:

forming a gate line and a gate electrode on a base substrate;

forming a gate insulation layer, an active layer, and a data metal layer on the base substrate formed the gate line and the gate electrode;

forming a photoresist film using a photoresist composition comprising a binder resin, a photo acid generator, an acryl resin represented by Chemical Formula 1, and a solvent, the photoresist film formed on the data metal layer;

forming a first photoresist pattern by patterning the photoresist film, the first photoresist pattern comprising a source electrode/line portion having a first thickness, a drain electrode portion having the first thickness, and a channel forming portion having a second thickness;

forming a data line and a channel portion by etching the data metal layer and the active layer using the first photoresist pattern as a mask;

forming a second photoresist pattern by removing the channel forming portion of the first photoresist pattern, the second photoresist pattern exposing a portion of the data metal layer;

forming a source electrode and a drain electrode by etching the data metal layer using the second photoresist pattern as a mask; and

forming an ohmic contact pattern by etching the active layer using the second photoresist pattern as a mask,

wherein R 1 , R 2 , R 3 , R 4 , and R 5 each represent a hydrogen atom or an alkyl group having 1-4 carbon atoms, and a, b, d, and e each represent a value in a range of about 0.01 to about 0.99, and the sum of a, b, d, and e is 1.

2. The method of claim 1 , wherein a is about 0.5 to about 0.6, b is about 0.25 to about 0.35, d is about 0.05 to about 0.15, and e is about 0.01 to about 0.1.

3. The method of claim 2 , wherein the acryl resin is represented by Chemical Formula 2,

4. The method of claim 1 , further comprising a hydroxyl phenol derivative represented by Chemical Formula 3,

wherein R 6 , R 7 , and R 8 each represent an alkyl group having 1-3 carbon atoms.

5. The method of claim 4 , wherein R 6 , R 7 , and R 8 each represent a methyl group.

6. The method of claim 1 , wherein a weight average molecular weight of the acryl resin is about 5,000 to about 30,000.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2022
From: MERCK PATENT GMBH
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 060102/0459 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2016
From: MERCK ELECTRONIC MATERIALS LTD.
To: MERCK PATENT GMBH
Reel/Frame 040243/0465 →
CHANGE OF NAME Recorded Nov 7, 2016
From: AZ ELECTRONIC MATERIALS KOREA LTD.
To: MERCK ELECTRONIC MATERIALS LTD.
Reel/Frame 040574/0815 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2013
From: AZ ELECTRONIC MATERIALS (JAPAN) K.K
To: AZ ELECTRONIC MATERIALS (KOREA) LTD.
Reel/Frame 029649/0583 →
CHANGE OF NAME Recorded Aug 28, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028863/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2008
From: LEE, HI-KUK; YUN, SANG-HYUN; LEE, MIN-SOO; KANG, DEOK-MAN; OH, SAE-TAE; CHOI, JAE-YOUNG
To: SAMSUNG ELECTRONICS CO., LTD.; AZ ELECTRONIC MATERIALS (JAPAN) K.K.
Reel/Frame 021934/0250 →