Patent Assignment
Reel/Frame 021937/0668
Assignment of Assignor's Interest
Recorded: 2008-12-08
Pages: 5
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area Around the Device for Electrical Interconnection to Other Devices
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Missing Inventor Name Previously Recorded on Reel 021937 Frame 0668. Assignor(S) Hereby Confirms the Assignment.
Jan 12, 2009
From: DO, BYUNG TAI; PAGAILA, REZA A.; CHUA, LINDA PEI EE
To: STATS CHIPPAC, LTD.
Reel/Frame 022087/0902 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0280 →
Release of Security Interest
Jun 8, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052864/0057 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 38378 Frame: 0280)
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 064789/0474 →
Corrective Assignment to Correct the Receiving Party Name Previously Recorded at Reel: 064789 Frame: 0474 Assignor(S) Hereby Confirms the Change of Name.
Sep 8, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064842/0046 →