Patent Assignment
Reel/Frame 021946/0752
Assignment of Assignor's Interest
Recorded: 2008-12-09
Pages: 6
Assignors
HWANG, CHAN HA
Executed: 2008-12-03
SOHN, EUN SOOK
Executed: 2008-12-03
CHOI, HO
Executed: 2008-12-03
KIM, BYONG JIN
Executed: 2008-12-03
YOO, JI YEON
Executed: 2008-12-03
LEE, MIN WOO
Executed: 2008-12-05
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE RD., CHANDLER, ARIZONA, 85248
Covered Property
(1)
Package in Package Semiconductor Device with Film Over Wire
Patent:
8,487,420 →
Application:
12/330,424 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →