Patent Assignment
Reel/Frame 021989/0581
Assignment of Assignor's Interest
Recorded: 2008-12-16
Pages: 3
Assignor
CAMACHO, ZIGMUND RAMIREZ
Executed: 2008-12-05
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Leadless Integrated Circuit Packaging System and Method of Manufacture Thereof
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0301 →
Release of Security Interest
Jun 11, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052907/0650 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0301. Assignor(S) Hereby Confirms the Change of Name.
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064913/0352 →