Patent Assignment
Reel/Frame 022053/0558
Assignment of Assignor's Interest
Recorded: 2009-01-05
Pages: 4
Assignors
HAN, KWON WHAN
Executed: 2008-12-19
PARK, CHANG JUN
Executed: 2008-12-19
KIM, SEONG CHEOL
Executed: 2008-12-19
KIM, SUNG MIN
Executed: 2008-12-19
CHOI, HYEONG SEOK
Executed: 2008-12-19
LEE, HA NA
Executed: 2008-12-19
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Stack Package Using Through-Electrodes
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 6, 2024
From: HYNIX-SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067328/0814 →
Assignment of Assignor's Interest
May 9, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067369/0832 →
Corrective Assignment to Correct the Assignee Is Hynix Semiconductor Inc. Not Hynix-Semiconductor Inc. There Is No Hyphen in the Name. Previously Recorded on Reel 67328 Frame 814. Assignor(S) Hereby Confirms the Change of Name.
May 14, 2024
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067412/0482 →