Patent Assignment
Reel/Frame 022088/0073
Corrective Assignment to Correct the Mising Inventor Name Previously Recorded on Reel 021958 Frame 0162. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2009-01-12
Pages: 7
Assignors
TAY, LIONEL CHIEN HUI
Executed: 2008-12-02
FANG, JIANMIN
Executed: 2008-12-02
CAMACHO, ZIGMUND R.
Executed: 2008-12-02
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming a Conductive via-in-via Structure
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 10, 2008
From: TAY, LIONEL CHIEN HUI; FANG, JIANMING
To: STATS CHIPPAC, LTD.
Reel/Frame 021958/0162 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0252 →
Release of Security Interest
Jun 8, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052864/0057 →
Corrective Assignment to Correct the the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0252. Assignor(S) Hereby Confirms the Assignment.
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 065236/0784 →