IP Library › Assignment 022116/0318
Patent Assignment
Reel/Frame 022116/0318

Assignment of Assignor's Interest

Recorded: 2009-01-16 Pages: 5
Assignors
HUA, YOUNAN
Executed: 2009-01-15
REDKAR, SHAILESH
Executed: 2009-01-15
Assignee
CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property (1)
Method to Prevent Corrosion of Bond Pad Structure
Patent: 8,207,052 →
Application: 12/354,777 →
Publication: US 2010/0184285
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 28, 2012
From: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
To: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
Reel/Frame 028276/0873 →
Change of Name May 28, 2012
From: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 028276/0875 →
Security Agreement Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →