IP Library › Assignment 028276/0873
Patent Assignment
Reel/Frame 028276/0873

Change of Name

Recorded: 2012-05-28 Pages: 2
Assignor
Assignee
CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property (1)
Method to Prevent Corrosion of Bond Pad Structure
Patent: 8,207,052 →
Application: 12/354,777 →
Publication: US 2010/0184285
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 16, 2009
From: HUA, YOUNAN; REDKAR, SHAILESH
To: CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
Reel/Frame 022116/0318 →
Change of Name May 28, 2012
From: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 028276/0875 →
Security Agreement Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →