Patent Assignment
Reel/Frame 022158/0470
Assignment of Assignor's Interest
Recorded: 2009-01-27
Pages: 4
Assignors
KIKUCHI, KATSUMI
Executed: 2008-12-24
YAMAMICHI, SHINTARO
Executed: 2008-12-24
MURAI, HIDEYA
Executed: 2008-12-24
FUNAYA, TAKUO
Executed: 2008-12-24
MORI, KENTARO
Executed: 2008-12-24
MAEDA, TAKEHIKO
Executed: 2008-12-24
HONDA, HIROKAZU
Executed: 2008-12-24
OGAWA, KENTA
Executed: 2008-12-24
TSUKANO, JUN
Executed: 2008-12-24
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOYKO, JAPAN
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Wiring Board, Semiconductor Device Using Wiring Board and Their Manufacturing Methods
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 28, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025214/0678 →
Assignment of Assignor's Interest
Jul 12, 2013
From: NEC CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 030783/0873 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →