Patent Assignment
Reel/Frame 022196/0712
Assignment of Assignor's Interest
Recorded: 2009-02-03
Pages: 4
Assignors
ITAMI, YASUO
Executed: 2008-12-18
MITSUHASHI, HISASHI
Executed: 2008-12-11
MASUTANI, TETSUYA
Executed: 2008-12-11
Assignee
DAIKIN INDUSTRIES, LTD.
UMEDA CENTER BUILDING, 4-12 NAKAZAKI-NISHI 2-CHOME, KITA-KU, OSAKA-SHI, OSAKA, 530-8323, JAPAN
Covered Property
(1)
Fluorosilicone Mold Release Composition
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 3, 2009
From: HUPFIELD, PETER CHESHIRE
To: DOW CORNING LTD.
Reel/Frame 022196/0888 →
Assignment of Assignor's Interest
Feb 3, 2009
From: DOW CORNING LTD.
To: DOW CORNING CORPORATION
Reel/Frame 022197/0083 →
Assignment of Assignor's Interest
Feb 3, 2009
From: KLEYER, DONALD LEE
To: DOW CORNING CORPORATION
Reel/Frame 022197/0167 →
Assignment of Assignor's Interest
Dec 10, 2015
From: DOW CORNING CORPORATION
To: DAIKIN INDUSTRIES, LTD.
Reel/Frame 037257/0538 →