Patent Assignment
Reel/Frame 022196/0888
Assignment of Assignor's Interest
Recorded: 2009-02-03
Pages: 3
Assignor
HUPFIELD, PETER CHESHIRE
Executed: 2008-12-17
Assignee
DOW CORNING LTD.
CARDIFF ROAD, BARRY, SOUTH GLAMORGAN, WALES, CF63 2YL, UNITED KINGDOM
Covered Property
(1)
Fluorosilicone Mold Release Composition
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 3, 2009
From: ITAMI, YASUO; MITSUHASHI, HISASHI; MASUTANI, TETSUYA
To: DAIKIN INDUSTRIES, LTD.
Reel/Frame 022196/0712 →
Assignment of Assignor's Interest
Feb 3, 2009
From: DOW CORNING LTD.
To: DOW CORNING CORPORATION
Reel/Frame 022197/0083 →
Assignment of Assignor's Interest
Feb 3, 2009
From: KLEYER, DONALD LEE
To: DOW CORNING CORPORATION
Reel/Frame 022197/0167 →
Assignment of Assignor's Interest
Dec 10, 2015
From: DOW CORNING CORPORATION
To: DAIKIN INDUSTRIES, LTD.
Reel/Frame 037257/0538 →