IP Library Granted Patent US 8,497,340
Granted Patent B2
US 8,497,340 · App. 12/305,738 · Granted Jul 30, 2013

Fluorosilicone mold release composition

Inventors: Yasuo Itami (Osaka, JP); Hisashi Mitsuhashi (Osaka, JP); Tetsuya Masutani (Osaka, JP); Peter Cheshire Hupfield (South Glamorgan, GB); Don Lee Kleyer (Midland, MI)
Assignees: Daikin Industries, Ltd.; Dow Corning Ltd.
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Quick Facts
Patent No.
US 8,497,340
App. No.
12/305,738
Granted
Jul 30, 2013
Kind
B2
Abstract

Disclosed in a mold release composition comprising a fluorosilicone compound of the formula (I): (I) wherein R1, R2, R4, R5, R6, R7, R8 and R9 each is, the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, R3 and R10 each is; the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, or Rf—X—, or Z—Y— in which X and Y each is; the same or different, a divalent organic group, Rf is a C1-6 fluoroalkyl group, Z is a silyl group containing a hydrolyzable site, m is 1-100, n is 1-50, and o is 0-200. The mold release composition can give excellent mold releasability and durability of mold releasability (repeated mold releasability).

Claims (25)

1. A mold release composition comprising a fluorosilicone compound of the formula (I):

wherein

R 1 , R 2 , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each is, the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group,

R 3 and R 10 each is, the same or different, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, Rf—X—, or Z—Y—,

X is an alkyleneoxyalkylene group,

Y a divalent organic group,

Rf is a pentafluoroethyl group,

Z is a silyl group containing a hydrolyzable site,

m is from 1 to 100, n is from 1 to 50, and o is from 0 to 200.

2. The mold release composition according to claim 1 , wherein, in the formula (I), Z is —Si(R 11 ) q (OR 12 ) 3-q in which R 11 and R 12 each is, the same or different, an alkyl group having 1 to 4 carbon atoms, and q is 0, 1 or 2.

3. The mold release composition according to claim 1 , wherein, in the formula (I), Y is —(CH 2 ) r — in which r is an integer of 2 to 20.

4. The mold release composition according to claim 1 , which further contains a curing accelerating catalyst in the amount of 0.05 parts by weight to 10 parts by weight, based on 100 parts by weight of the fluorosilicone compound (I).

5. The mold release composition according to claim 1 , which further contains at least one selected from the group consisting of a silicone oil, a silicone resin, a synthesis wax, a natural wax, a fluorooil and a fluororesin in the amount of 0.1 to 99 parts by weight, based on 100 parts by weight of the fluorosilicone compound (I).

6. A mold release agent comprising a solution of the composition according to claim 1 in an organic solvent.

7. An aerosol comprising the mold release agent according to claim 6 filled with a propellant.

8. A fluorosilicone compound of the formula (I):

wherein

R 1 , R 2 , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each is, the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group,

R 3 and R 10 each is, the same or different, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, Rf—X—, or Z—Y—,

X is an alkyleneoxyalkylene group,

Y a divalent organic group,

Rf is a pentafluoroethyl group,

Z is a silyl group containing a hydrolyzable site,

m is from 1 to 100, n is from 1 to 50, and o is from 0 to 200.

9. The mold release composition according to claim 1 , wherein o is 1 to 200.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2015
From: DOW CORNING CORPORATION
To: DAIKIN INDUSTRIES, LTD.
Reel/Frame 037257/0538 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2009
From: ITAMI, YASUO; MITSUHASHI, HISASHI; MASUTANI, TETSUYA
To: DAIKIN INDUSTRIES, LTD.
Reel/Frame 022196/0712 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2009
From: HUPFIELD, PETER CHESHIRE
To: DOW CORNING LTD.
Reel/Frame 022196/0888 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2009
From: DOW CORNING LTD.
To: DOW CORNING CORPORATION
Reel/Frame 022197/0083 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2009
From: KLEYER, DONALD LEE
To: DOW CORNING CORPORATION
Reel/Frame 022197/0167 →
Continuity (2)
Provisional Application 60815527 · Jun 21, 2006
Related Publication 20100126380A1 · May 27, 2010