Assignment of Assignor's Interest

Recorded: 2009-03-13 Pages: 4

Assignors

OH, JAE SUNG

Executed: 2008-12-24

HYUN, MOON UN

Executed: 2008-12-24

KIM, JONG HYUN

Executed: 2008-12-24

GWON, JIN HO

Executed: 2008-12-24

CHA, KI BON

Executed: 2008-12-24

Assignee

HYNIX SEMICONDUCTOR INC.

SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Package and Stacked Semiconductor Package Having the Same

Patent: 8,299,591 →

Application: 12/347,005 →

Publication: US 2010/0072598

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.