IP Library › Assignment 033417/0988
Patent Assignment
Reel/Frame 033417/0988

Assignment of Assignor's Interest

Recorded: 2014-07-25 Pages: 3
Assignor
KIM, DONG YOU
Executed: 2014-07-18
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SI, GYEONGGI-DO, 467-860, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package and Stacked Semiconductor Package Having the Same
Patent: 8,299,591 →
Application: 12/347,005 →
Publication: US 2010/0072598
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 13, 2009
From: OH, JAE SUNG; HYUN, MOON UN; KIM, JONG HYUN; GWON, JIN HO
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 022394/0150 →
Change of Name Aug 23, 2013
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 031076/0190 →