IP Library › Assignment 031076/0190
Patent Assignment
Reel/Frame 031076/0190

Change of Name

Recorded: 2013-08-23 Pages: 48
Assignor
HYNIX SEMICONDUCTOR INC.
Executed: 2012-03-23
Assignee
SK HYNIX INC.
2091 GYEONGCHUNGDAE-RO, BUBAL-EUP, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package and Stacked Semiconductor Package Having the Same
Patent: 8,299,591 →
Application: 12/347,005 →
Publication: US 2010/0072598
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 13, 2009
From: OH, JAE SUNG; HYUN, MOON UN; KIM, JONG HYUN; GWON, JIN HO
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 022394/0150 →
Assignment of Assignor's Interest Jul 25, 2014
From: KIM, DONG YOU
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 033417/0988 →