Patent Assignment
Reel/Frame 022632/0251
Assignment of Assignor's Interest
Recorded: 2009-05-04
Pages: 18
Assignor
IRVINE SENSORS CORPORATION
Executed: 2009-03-16
Assignee
APROLASE DEVELOPMENT CO., LLC
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Property
(1)
Three-Dimensional Module Comprised of Layers Containing Ic Chips with Overlying Interconnect Layers
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jan 5, 2007
From: IRVINE SENSORS CORP.
To: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
Reel/Frame 018746/0842 →
Assignment of Assignor's Interest
Mar 5, 2007
From: PEPE, ANGEL; YAMAGUCHI, JAMES
To: IRVINE SENSORS CORP.
Reel/Frame 019002/0040 →
Release of Security Interest
Jul 22, 2011
From: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
To: IRVINE SENSORS CORPORATION
Reel/Frame 026632/0405 →
Merger
Dec 30, 2015
From: APROLASE DEVELOPMENT CO., LLC
To: NYTELL SOFTWARE LLC
Reel/Frame 037406/0200 →