IP Library Assignment 022696/0042
Patent Assignment
Reel/Frame 022696/0042

Assignment of Assignor's Interest

Recorded: 2009-05-18 Pages: 6
Assignors
HAN, SUH JOON
Executed: 2007-02-09
WASSERMAN, SCOTT H.
Executed: 2007-02-22
PAQUETTE, MIKE S.
Executed: 2007-02-09
PAWLOWSKI, DAVID F.
Executed: 2007-02-05
CIESLINSKI, ROBERT C.
Executed: 2007-02-05
Assignee
DOW GLOBAL TECHNOLOGIES INC.
WASHINGTON STREET, 1790 BUILDING, MIDLAND, MICHIGAN, 48674
Covered Property (1)
Semi-Conducting Polymer Compositions for the Preparation of Wire and Cable
Patent: 7,863,522 →
Application: 11/613,771 →
Publication: US 2008/0149363
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address May 18, 2009
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 022696/0269 →
Change of Name Jun 8, 2017
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 042732/0787 →