IP Library Assignment 022696/0269
Patent Assignment
Reel/Frame 022696/0269

Change of Address

Recorded: 2009-05-18 Pages: 2
Assignor
DOW GLOBAL TECHNOLOGIES INC.
Executed: 2007-06-20
Assignee
DOW GLOBAL TECHNOLOGIES INC.
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property (1)
Semi-Conducting Polymer Compositions for the Preparation of Wire and Cable
Patent: 7,863,522 →
Application: 11/613,771 →
Publication: US 2008/0149363
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 18, 2009
From: HAN, SUH JOON; WASSERMAN, SCOTT H.; PAQUETTE, MIKE S.; PAWLOWSKI, DAVID F.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 022696/0042 →
Change of Name Jun 8, 2017
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 042732/0787 →