IP Library Assignment 042732/0787
Patent Assignment
Reel/Frame 042732/0787

Change of Name

Recorded: 2017-06-08 Pages: 5
Assignor
DOW GLOBAL TECHNOLOGIES INC.
Executed: 2010-12-31
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property (1)
Semi-Conducting Polymer Compositions for the Preparation of Wire and Cable
Patent: 7,863,522 →
Application: 11/613,771 →
Publication: US 2008/0149363
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 18, 2009
From: HAN, SUH JOON; WASSERMAN, SCOTT H.; PAQUETTE, MIKE S.; PAWLOWSKI, DAVID F.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 022696/0042 →
Change of Address May 18, 2009
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 022696/0269 →